CROSS CONNECTING MULTILAYER THICK FILM CIRCUITS CROSS CONNECTING MULTILAYER THICK FILM CIRCUITS

摘要

1425373 Thick film printed circuits TELEFONAKTIEBOLAGET L M ERICSSON 11 May 1973 [18 May 1972] 22677/73 Heading H1R Contact between thick film circuit layers in a multi-layer thick film circuit element is achieved by making holes through the layers and intervening insulation, using a radiant energy e.g. laser or electronic beam and thereafter filling the holes with conductive material. The hole filling operation may take place simultaneously with formation of the top conductor pattern, and to reduce contact resistance with a buried conductor, two adjacent holes may be made, both filled with conductive material. Outputs may thus be derived from buried points of the circuit layers.