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process and device for the production of compound metal complex suitable for deposition of metal without electricity and operation of wet chemical metallization

机译:于生产复合金属配合物的方法和设备,该复合金属配合物适合于不用电沉积金属和进行湿法化学镀金属操作

摘要

Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided.
机译:通过以下方法在水溶液中形成适用于所述金属的无电沉积的金属配合物化合物:该方法包括提供络合剂的水溶液,将至少一个包含待沉积金属的阳极浸入该溶液中,并至少一个阴极,阳极和阴极连接到可调电流源,向阳极和阴极施加电流以在它们之间产生电压差,该电压差足以将金属从阳极溶解到络合剂的水溶液中,从而形成金属和络合剂的化合物,并从溶液中沉积较少量的金属到阴极上,以使溶液富集于金属络合物中。在本发明的其他实施例中,还提供了用于执行该过程的设备。

著录项

  • 公开/公告号IT7848566D0

    专利类型

  • 公开/公告日1978-03-23

    原文格式PDF

  • 申请/专利权人 KOLLMORGEN TECHNOLOGIES CORPORATION;

    申请/专利号IT19780048566

  • 发明设计人 FRITZ STAHL;HORST STEFFEN;

    申请日1978-03-23

  • 分类号C23C;

  • 国家 IT

  • 入库时间 2022-08-22 22:31:00

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