A method for electroless deposition of copper-containing metal layers on stainless steel and predetermined position solutions hand

摘要

Electroless plating of high grade steel, particularly wire, with Cu or Cu-Sn, to facilitate cold-deformation takes place by first treating the steel surfaces with aqs. solutions containing non-oxidising mineral acids, and 30-100 g/l Na hypophosphite and then with known solutions for electroless deposition of Cu-containing metal layers. Pref. steel surfaces are treated with aqs. solutions containing 90-140 g/l HCl and 30-100 g l NaH2PO2 and more pref. also 170-350 g/l H2SO4, at 15-80 degrees C for 5-15 min., and subsequently Cu-plated from aqs. solutions containing 1-20 g/l Cu, 1-10 g/l chloride, 15-400 g/l H2SO4 and 0.01-3 g/l inhibitor.