Protective coating for edge of semiconductor chips - with varnish applied to grooves produced by bevelled edges of stacked chips

摘要

Semiconductor chips with bevelled edges are held in a device treating a large number of chips, and provided with the protective coating at least at the areas where the p-n junction reaches the chip edge. The coating consists of a varnish based on a polymerisable and/or condensable substance and stabilising substances. The semiconductor chips (30) are stacked and firmly clamped in a tube, and the varnish is applied to the stack in the grooves produced by the bevelled edges of the chip. The tube (1) has internal flutes (2) and may be evacuated. It is fitted with end caps (20) and a compression spring (13) is inclined to retain the chips in close contact with one another.