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Diamond cutting and grinding system - has finely adjustable member and sensor controlling cutting angle and depth of cut

机译:钻石切割和磨削系统-具有精细可调的部件和传感器,可控制切割角度和切割深度

摘要

The diamond cutting, grinding and polishing system employs a system of coordinates for positioning the diamond to give a depth of cut according to a formula in which half the diameter of the diamond is divided by the sine of the angle of the facet. The diamond grinding machine used has a guide member (21) with a sensor (27, 28) which registers this depth of cut, and which can be adjusted for fine limits. This is combined with a switch (22) and the length of the sensor can be changed after the operation. A further contact is operated to control a motor or magnet to lift the diamond from the grinding tool. The sensor and the diamond holder (23) are made of a metal which is compensated for thermal expansion. A locating ball is incorporated, operated by a micrometer so that the facet angle and switch member can be finely adjusted.
机译:钻石切割,研磨和抛光系统采用坐标系,用于根据以下公式确定钻石的位置,以给出切割深度:钻石直径的一半除以刻面角的正弦值。所使用的金刚石磨床具有引导构件(21),该引导构件具有传感器(27、28),该传感器记录该切削深度,并且可以对其进行精细调整。它与一个开关(22)组合在一起,可以在操作后更改传感器的长度。操作另外的触点以控制电动机或磁体以将金刚石从研磨工具上提起。传感器和金刚石支架(23)由补偿了热膨胀的金属制成。装有一个定位球,用千分尺操作,以便可以精细地调节刻面角度和开关元件。

著录项

  • 公开/公告号DE2651868A1

    专利类型

  • 公开/公告日1978-05-18

    原文格式PDF

  • 申请/专利权人 MAGNUSSON GEB. SAUERBAUMGERDA;

    申请/专利号DE19762651868

  • 发明设计人

    申请日1976-11-13

  • 分类号B28D5/02;

  • 国家 DE

  • 入库时间 2022-08-22 21:59:48

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