首页> 外国专利> Electronic coil windings attachment to contact posts - involves solder bath which can be used to finish joints by dipping process

Electronic coil windings attachment to contact posts - involves solder bath which can be used to finish joints by dipping process

机译:电子线圈绕组连接到接触柱上-涉及焊料浴,可通过浸涂工艺完成接缝

摘要

A method is used for winding small coils for electronic circuit application. It is used particularly for attaching the coil windings to the coil contact terminal posts so that the joints can be finished using a solder bath. The coil winding is first wound to one terminal post (A1), in one direction, then reversed and wound in the other direction; from this the winding on to the coil chassis (WK) is undertaken, and finally the winding is wound o n to the second post (A2). The first post may then be dipped in a solder bath to finish the joint (L), while the winding on the second post (A2) is typically connected to another circuit.
机译:一种用于缠绕小线圈的方法,用于电子电路应用。它特别用于将线圈绕组连接到线圈触点端子柱上,以便可以使用焊锡浴完成接头。线圈绕组首先沿一个方向缠绕到一个接线柱(A1),然后反向并沿另一个方向缠绕;从此开始进行绕组到线圈架(WK),最后将绕组缠绕到第二支柱(A2)。然后可以将第一柱浸入焊料浴中以完成接缝(L),而第二柱(A2)上的绕组通常连接到另一个电路。

著录项

  • 公开/公告号DE2657060A1

    专利类型

  • 公开/公告日1978-06-15

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19762657060

  • 发明设计人 MAASSGERHARD;

    申请日1976-12-14

  • 分类号H01R43/02;H01F5/04;

  • 国家 DE

  • 入库时间 2022-08-22 21:59:22

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