Sealing compound for ceramics as well as discharge device with the use of these sealing compound

摘要

New sealant compositions for sealing end closures or inleads in ceramic envelopes are based on the system Dy.sub.2 O.sub.3 -Al.sub.2 O. sub.3 -SiO.sub.2. These compositions will withstand metal halides used as arc materials up to temperatures exceeding 1200° C, and make possible more efficient lamps of improved color rendition.