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Application of aluminium based alloy on silicon - without diffusing the aluminium into the silicon

机译:铝基合金在硅上的应用-无需将铝扩散到硅中

摘要

Conducting layers based on Al are formed on at least one active surface of a device comprising a semiconductor substrate obtd. by the planar method, are made by first forming an electrically insulating layer except in the contact forming zones, then simultaneously depositing over the whole active surface a layer of Al/Si alloy contg. at least a third metal selected from Fe, Cr, Mg, Cu, Mn and/or Ni, then covering the active surface with a mask inert to anodisation at the regions where contacts and interconnection are to be formed and finally anodising to oxidise the unprotected parts of the alloy coating.
机译:在包括半导体衬底obtd的器件的至少一个有源表面上形成基于Al的导电层。通过平面方法,首先在接触形成区中形成电绝缘层,然后在整个活性表面上同时沉积一层Al / Si合金,以形成平面法。选自铁,铬,镁,铜,锰和/或镍的至少第三种金属,然后在要形成接触和互连的区域用对阳极呈惰性的掩模覆盖有源表面,最后阳极氧化以氧化未保护的合金涂层的零件。

著录项

  • 公开/公告号FR2253274B1

    专利类型

  • 公开/公告日1978-07-07

    原文格式PDF

  • 申请/专利权人 RADIOTECHNIQUE COMPELEC;

    申请/专利号FR19730042841

  • 发明设计人

    申请日1973-11-30

  • 分类号H01L21/28;H01L21/88;H01L23/52;

  • 国家 FR

  • 入库时间 2022-08-22 21:49:49

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