首页> 外国专利> Matrix element for high density integrated semiconductors - which is simpler and smaller and applicable as detector or memory element

Matrix element for high density integrated semiconductors - which is simpler and smaller and applicable as detector or memory element

机译:用于高密度集成半导体的矩阵元件-更简单,更小,可用作检测器或存储元件

摘要

A matrix element has a diffused zone on the surface of a semiconducting body, and has on the semiconducting surface also, an electrically isolating layer, on which there is a conductor tracing a path. The insulting layer has a first thickness above the diffuses zone and a second thickness positioned laterally to the diffused zone and at a given distance from it. The second thickness is less than the first thickness and the diffuses zone is doped with an opposing conductivity to that of the semiconducting body. The semiconducting body is of doped silicon. The semiconducting body silicon is of the type p and the diffused zone has a doping of the type n+. The insulating layer consists of SiO2. The first thickness of the insulating layer above the diffused zone and its immediate neighbourhood is about 0,5/u whilst the second thickness is about 60nm. The conductive path on the upper surface is of aluminium. The element can be used both as a light detector and as an element in a memory. The matrix can have a high density of integrated semiconductors, and is simpler and smaller than structures known until now.
机译:矩阵元件在半导体本体的表面上具有扩散区,并且在半导体表面上还具有电绝缘层,在该电绝缘层上具有追踪路径的导体。所述绝缘层具有在所述扩散区上方的第一厚度和在所述扩散区侧向且与所述扩散区具有给定距离的第二厚度。第二厚度小于第一厚度,并且扩散区掺杂有与半导体相反的导电性。半导体主体是掺杂的硅。半导体硅为p型,扩散区的掺杂类型为n +。绝缘层由SiO 2组成。扩散区及其紧邻区域上方的绝缘层的第一厚度为约0.5 / u,而第二厚度为约60nm。上表面的导电路径是铝。该元件既可以用作光检测器又可以用作存储器中的元件。该基体可以具有高密度的集成半导体,并且比迄今为止已知的结构更简单,更小。

著录项

  • 公开/公告号FR2366699A1

    专利类型

  • 公开/公告日1978-04-28

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号FR19770028734

  • 发明设计人

    申请日1977-09-23

  • 分类号H01L29/06;G11C11/34;H01L31/00;

  • 国家 FR

  • 入库时间 2022-08-22 21:44:34

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