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Method for effecting reverse shape memory phenomena in Cu-Zn-Si brass alloy
Method for effecting reverse shape memory phenomena in Cu-Zn-Si brass alloy
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机译:在Cu-Zn-Si黄铜合金中影响反向形状记忆现象的方法
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摘要
A method for making an integrated circuit package includes the steps of fabricating lead frames from a copper-zinc-silicon beta brass alloy and soldering the leads thereof to semi-conductor chips by use of the shape memory and reverse shape memory characteristic of the alloy. The composition of the lead frame material and the choice and sequence of fabrication steps may be varied.
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