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BRIGHTENER COMPOSITION FOR ELECTRODEPOSITION OF TIN AND*OR LEAD* PLATING SOLUTION* AND ELECTRODEPOSITION USING SAME
BRIGHTENER COMPOSITION FOR ELECTRODEPOSITION OF TIN AND*OR LEAD* PLATING SOLUTION* AND ELECTRODEPOSITION USING SAME
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机译:电镀锡和/或铅*镀液*的增白剂组合物以及使用相同的电镀方法
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摘要
A composition is described which is useful particularly in improving the electrodeposition of tin, lead or tin-lead from an aqueous acidic plating bath. The new composition comprises a reaction product of an unsaturated nitrogen-containing heterocyclic compound with a mixture comprising formaldehyde and an unsaturated aliphatic aldehyde containing up to about six carbon atoms. Aqueous acidic plating baths containing the additive compositions of the invention, and methods for depositing tin, lead or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.
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