首页> 外国专利> A composite comprising a polycrystalline diamentlegeme which is integrally bonded to a substrate of polycrystalline silicon carbide or silicon nitride as well as the process for its preparation

A composite comprising a polycrystalline diamentlegeme which is integrally bonded to a substrate of polycrystalline silicon carbide or silicon nitride as well as the process for its preparation

机译:包含多晶硬质合金的复合材料及其制备方法,所述多晶硬质合金整体结合到多晶硅碳化硅或氮化硅的基材上

摘要

The composite comprises diamond crystals and a substrate of polycrystalline silicon carbide or silicon nitride bonded by silicon carbide and a carbide and/or silicide of a metal which forms a silicide with silicon. A mass of diamond crystals in contact with a mass of eutectiferous silicon-rich alloy and a silicon carbide or silicon nitride ceramic substrate are disposed in a container and placed within a pressure transmitting powder medium. Pressure is applied to the powder medium resulting in substantially isostatic pressure being applied to the container and its contents sufficient to dimensionally stabilize the container and its contents. The resulting shaped substantially isostatic system of powder-enveloped container is hot-pressed whereby fluid eutectiferous silicon-rich alloy is produced and infiltrated through the interstices between the diamond crystals and contacts the contacting face of the substrate sufficiently producing, upon cooling, an adherently bonded integral composite. In a modification, the use of a container is avoided by pressing a cavity in the pressure transmitting powder medium, placing the silicon-rich alloy, diamond crystals and silicon carbide or silicon nitride substrate in the cavity, covering the cavity with further powder medium, then applying isostatic pressure and hot pressing.
机译:该复合物包括金刚石晶体和由碳化硅和与硅形成硅化物的金属的碳化物和/或硅化物结合的碳化硅或氮化硅的衬底。与大量富共晶的富硅合金和碳化硅或氮化硅陶瓷基板接触的大量金刚石晶体被放置在容器中,并被放置在压力传递粉末介质中。对粉末介质施加压力,导致对容器及其内容物施加基本等静压,足以使容器及其内容物尺寸稳定。将所得的粉末包封的容器的成型的基本等静压体系进行热压,从而生产出流体共晶的富硅合金,并通过金刚石晶体之间的间隙渗透,并与基材的接触面充分接触,冷却后产生粘结的粘结整体复合材料。在一种变型中,通过在压力传递粉末介质中按压空腔,将富硅合金,金刚石晶体和碳化硅或氮化硅衬底置于空腔中,用其他粉末介质覆盖空腔,从而避免了使用容器,然后施加等静压并热压。

著录项

  • 公开/公告号DK469278A

    专利类型

  • 公开/公告日1979-04-22

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC CO;

    申请/专利号DK19780004692

  • 发明设计人 LEE M;SZALA L E;DEVRIES C;

    申请日1978-10-20

  • 分类号C04B;

  • 国家 DK

  • 入库时间 2022-08-22 20:47:00

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