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ELECTROPLATING OF RHODIUM-RUTHENIUM ALLOYS

机译:电镀铑-钌合金

摘要

RHODIUM-RUTHENIUM ALLOYSABSTRACT OF THE DISCLOSUREDisclosed is an electroplating bath suitable fordepositing a rhodium-ruthenium alloy containing at least 90weight % rhodium. Rhodium and ruthenium axe present in theplating bath in the form of soluble platable compounds in apreferred weight ratio of at least about 10:1. The depositsobtained by this bath exhibit improved brightness over comparablebaths even without the addition of lead, and also exhibitreduced stress as compared to deposits obtained from rhodium-platinum baths.
机译:铑-钌合金披露摘要公开了一种适用于沉积至少含90的铑-钌合金重量%铑。铑和钌斧存在于电镀液中可溶性可镀化合物的形式优选的重量比至少约为10∶1。存款通过这种浴液获得的亮度比同类产品高甚至不添加铅的浴液,也表现出与从铑获得的沉积物相比,应力降低了铂金浴。

著录项

  • 公开/公告号CA1050471A

    专利类型

  • 公开/公告日1979-03-13

    原文格式PDF

  • 申请/专利权人 OXY METAL INDUSTRIES CORPORATION;

    申请/专利号CA19740202944

  • 发明设计人 DEUBER JOHN M.;STEVENS PETER;

    申请日0000-00-00

  • 分类号C25D3/56;

  • 国家 CA

  • 入库时间 2022-08-22 20:14:16

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