Electrolyte and method for electrodepositing rhodium-ruthenium alloys

摘要

Disclosed is an electroplating bath suitable for depositing a rhodium-ruthenium alloy containing at least 90 weight % rhodium. Rhodium and ruthenium are present in the plating bath in the form of soluble platable compounds in a weight ratio of from 10:1 to 200:1. The deposits obtained by this bath exhibit improved brightness over comparable baths even without the addition of lead, and also exhibit reduced stress as compared to deposits obtained from rhodium-platinum baths.