Silver alloy dental solder contg. no cadmium - used for soldering palladium-silver dental alloys contains gold, palladium, copper and indium

摘要

Silver base dental solder alloy, contg. (by wt.) 50-85% Ag; 6-15% Au; 0.1-7% Pa; 5-20% Cu; and 1-8% In. The alloy may also contain =6% Sn; and the pref. alloys have the compsn. (a) 69% Ag, 12.1% Au, 4.1% Pd, 11% Cu, and 3.8% Inf or (b) 69% Ag, 10.2% Au, 1.0% Pd, 11% Cu, 5.9% In, and 2.9% Sn. Use in the soldering of palladium-silver dental alloys. The solder alloy is free from cadmium, which can form volatile toxic cpds. during soldering. The colour of the solder matches that of the Pd/Ag alloys; and its low density means that it is less expensive than conventional white dental solders.