首页> 外国专利> Wire channel for distributing wires in high density circuits - has slots in its sides for wire ends and is put upside down between rows of soldering tags

Wire channel for distributing wires in high density circuits - has slots in its sides for wire ends and is put upside down between rows of soldering tags

机译:用于在高密度电路中分配电线的电线通道-侧面有用于电线末端的插槽,并且上下颠倒放置在成排的焊接标签之间

摘要

The wires are laid between rows of soldering tags, with their ends correctly clamped in slots of the U-shaped channel whose open side faces the clamped ends of the tags. The channel is placed between the rows of tags, and its open slots reach in the channel sides and/or its bottom up to the connection point of the wires. The distance between the channel (8) sides is equal to the distance between the tags, and the channel (8) sides and/or its bottom have recesses for the tags.
机译:电线放置在成排的焊接标签之间,其末端正确地夹在U形通道的槽中,该槽的开口侧面向标签的被夹持端。通道放置在标签行之间,通道的开口槽到达通道侧面和/或底部直至导线的连接点。通道(8)侧面之间的距离等于标签之间的距离,并且通道(8)侧面和/或其底部具有用于标签的凹槽。

著录项

  • 公开/公告号DE2743464A1

    专利类型

  • 公开/公告日1979-04-05

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19772743464

  • 发明设计人 PELZLLEO;

    申请日1977-09-27

  • 分类号H02B1/20;

  • 国家 DE

  • 入库时间 2022-08-22 19:48:43

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