首页> 外国专利> Semiconductor layer stripping of single-core power cable - by using cutter with U=shaped cutting edge and continuous and fine adjustment of cutting depth

Semiconductor layer stripping of single-core power cable - by using cutter with U=shaped cutting edge and continuous and fine adjustment of cutting depth

机译:单芯电力电缆的半导体层剥线-使用具有U =形刀刃并连续且精细调整切割深度的切割器

摘要

Triple-extruded heavy current single-core cable with solid insulation has a semiconductor outer layer removed by an appliance gripping the cable core to cut a U-shaped groove in the semiconductor layer, e.g. of graphite and semiconducting strips, to be stripped off. The cutter used has a U-shaped cutting edge. The depth of cut of the tool is continuously or finely adjusted to avoid the depth of cut exceeding the permissible threshold deoth with consequent possibility of partial electrical discharges occurring leading to gradual destruction of the insulating material.
机译:具有固体绝缘的三重挤出大电流单芯电缆具有一个半导体外层,该外层可通过以下装置移除:握住电缆芯以在半导体层中切割U形凹槽的设备,例如剥去的石墨和半导体带。所使用的刀具具有U形的切削刃。连续地或精细地调节工具的切削深度,以避免切削深度超过允许的阈值齿,从而可能发生局部放电,从而逐渐破坏绝缘材料。

著录项

  • 公开/公告号DE2816966A1

    专利类型

  • 公开/公告日1979-10-31

    原文格式PDF

  • 申请/专利权人 HESSISCHE ELEKTRIZITAETS-AG;

    申请/专利号DE19782816966

  • 发明设计人 BLECHSCHMIDTHORSTDIPL.-ING.;

    申请日1978-04-19

  • 分类号H02G1/12;

  • 国家 DE

  • 入库时间 2022-08-22 19:45:48

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