首页> 外国专利> ADHESIVE COMPOSITION USED IN STICKING THIN SLICED VENEER

ADHESIVE COMPOSITION USED IN STICKING THIN SLICED VENEER

机译:粘薄切片用胶粘剂

摘要

PURPOSE:To obtain an adhesive used in sticking thin sliced veneer, which is free from problems of exudation and reduction in productivity, by adding inorganic fine powder to a mixed paste obtained by adding a filler to an aqueous resin adhesive. CONSTITUTION:To a mixed paste prepared by adding a filler, such as wheat flour or soybean powder, to an aqueous resin adhesive such as a urea resin, a melamine resin, a vinyl acetate emulsion, or an SBR latex, is added 0.1-10% of inorganic fine powder, particle diameter =0.1mu, such as fine silicic acid powder, light calcium carbonate, clay or magnesium carbonate. As said inorganic fine powder, fine silicic acid powder, particle diameter =0.05mu, which, in a small amount, shows a thickening effect, is particularly preferred. The amount of the inorganic fine powder added depends on the particle diameter, oil absorptivity, etc. When the fine silicic acid powder, particle diameter =0.05mu, is used, the amount added is preferably 0.1- 10%, based on the mixed paste, and the addition of more than 10% does not bring about an additional effect, but adversely effects the adhesiveness.
机译:用途:通过将无机细粉添加到通过将填料添加到水性树脂粘合剂中而获得的混合糊剂中,获得一种用于粘贴薄木皮的粘合剂,该粘合剂不存在渗出和生产率降低的问题。组成:向通过将填充剂(例如小麦粉或大豆粉)添加到水性树脂粘合剂(例如尿素树脂,三聚氰胺树脂,乙酸乙烯酯乳液或SBR乳胶)中而制成的混合糊中,添加0.1-10 %的粒径≤0.1μ的无机细粉,例如细硅酸粉,轻质碳酸钙,粘土或碳酸镁。作为所述无机细粉,特别优选粒径<=0.05μ的硅酸细粉,其少量表现出增稠作用。无机细粉的添加量取决于粒径,吸油率等。当使用粒径<=0.05μ的硅酸细粉时,基于混合量优选为0.1〜10%。糊剂,并且添加超过10%不会带来额外的效果,但是会不利地影响粘合性。

著录项

  • 公开/公告号JPS55139473A

    专利类型

  • 公开/公告日1980-10-31

    原文格式PDF

  • 申请/专利权人 AIKA KOGYO KK;

    申请/专利号JP19790047682

  • 发明设计人 HASEGAWA MASANOBU;

    申请日1979-04-19

  • 分类号C09J11/04;

  • 国家 JP

  • 入库时间 2022-08-22 19:09:00

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