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Formation of epitaxial layers of semiconductor material - uses deposition from gas phase, with selected proportions of solid constituents added, for evaporation and subsequent deposition

机译:半导体材料外延层的形成-使用气相沉积,并添加选定比例的固体成分,以进行蒸发和后续沉积

摘要

The epitaxial layers of solid semiconductor are used in the manufacture of integrated circuits. The structures are produced at temperatures in the region where the material can be separated with a composition of high homogeneity. The layers are grown from a gas phase during the transmission of output materials from the substrate. The substrate is filled with two of the initial materials with different contents of varying components. The ratio of the surface content of any local section of the substrate supplied with solids (1, 2) periodically for gas phase deposition is chosen such that the proportion of the period of dwell of the solids added will correspond with the interval in each period for each local section of the substrate (3) necessary for the transmission of a quantity of the material. The proportion of the surface content of materials will be constant and equal for the whole surface.
机译:固体半导体的外延层用于集成电路的制造。该结构是在材料可以被高均质成分分离的区域中的温度下产生的。在从基板传输输出材料期间,这些层是从气相生长的。用两种具有不同含量的不同成分的初始材料填充基材。选择周期性地供应有用于气相沉积的固体(1、2)的基板的任何局部区域的表面含量的比率,以使得所添加的固体的停留时间的比例将对应于每个周期的间隔。基材(3)的每个局部区域对于传输一定数量的材料都是必需的。材料表面含量的比例对于整个表面而言将是恒定且相等的。

著录项

  • 公开/公告号FR2380816B1

    专利类型

  • 公开/公告日1980-04-25

    原文格式PDF

  • 申请/专利权人 INSTITUT REDKOMETAL PROMYSHLENNO;

    申请/专利号FR19770004595

  • 发明设计人

    申请日1977-02-17

  • 分类号B01J17/30;H01L21/203;H01L21/363;

  • 国家 FR

  • 入库时间 2022-08-22 17:24:10

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