DRAWING OUT METHOD OF LEAD WIRE OF IC PARTS AND LEAD WIRE DRAWING OUT DEVICE USED FOR PRACTICE OF METHOD

摘要

PURPOSE:To enable the all lead wires of the to-be-removed IC parts which are soldered to a printed circuit base board to surely be draw out from the printed circuit base board by one time operation. CONSTITUTION:A receptor 3 receiving a molten solder A therein and a receptor 8 receiving solder dregs A' from the receptor 3 are located on the top of the lead wire draw out device main body 5, a heating mechanism 9 supplying a solder fusing heat is installed on a frame 10 at the bottom within the device body 5, and a heating unit 12 is connected to the bottom 3a of the receptor 3. A lead wire leg 4a projecting below the printed circuit base board 1 of the IC parts 2 to be removed is inserted into the solder liquid A in the saucer 3. In this condition, the solder fixing the lead wire 4 to the printed circuit base board 1 is fused and the lead wire 4 is left separable from the printed circuit base board 1. In this condition, the all lead wires 4 can be drawn out by one operation by pulling up the IC parts 2.