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JUDGING METHOD OF CAUSES OF FAULTIN NONELECTROLYTIC PLATING

机译:非电解镀层故障原因的判断方法

摘要

PURPOSE:To effect an accurate and quick judgement of the causes of faulty plating by measuring the initial reaction of nonelectrolytic plating from the quantity of light transmitted through the material and plating time during nonelectrolytic plating of transparent or semitransparent material. CONSTITUTION:Nonelectrolytic plating solution 5 is charged in a beaker 1, stirred with rotator 4, and transparent or semitransparent material 6 is immersed in the solution. From the projector 7, parallel light beam is projected onto the material 6, and transmitted light is received by the receptor 9. The quantity of light is converted to voltage by the prebox 10, and is recorded by the recorder 11. Plating intial reaction that affects plate thickness is controlled by plating metal ion concentration in nonelectrolytic plating solution, sensitizing time of the material 6, and the succeeding washing time. Thus, the change in plating thickness with time is accurately measured by the transmitted light quantity, so that the causes of faulty plating are adequately detected and proper counteractions can be provided.
机译:目的:通过在透明或半透明材料的非电解镀覆过程中,通过透射材料的光量和镀覆时间来测量非电解镀覆的初始反应,从而准确,快速地判断镀层不良的原因。组成:非电解镀液5装入烧杯1中,与转子4搅拌,然后将透明或半透明的材料6浸入该溶液中。从投影仪7,平行光束被投射到材料6上,并且透射光被接收器9接收。光的量被预盒10转换为电压,并由记录器11记录。通过在非电解电镀液中电镀金属离子浓度,材料6的敏化时间以及后续的清洗时间,可以控制影响板厚的方法。因此,通过透射光量可以准确地测量镀覆厚度随时间的变化,从而可以充分地检测出镀覆不良的原因,并且可以提供适当的抵抗作用。

著录项

  • 公开/公告号JPS5643382B2

    专利类型

  • 公开/公告日1981-10-12

    原文格式PDF

  • 申请/专利权人

    申请/专利号JP19790003385

  • 发明设计人

    申请日1979-01-18

  • 分类号H05K3/18;C23C2/14;C23C18/16;C23C18/31;C23C18/40;

  • 国家 JP

  • 入库时间 2022-08-22 16:34:54

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