PROCEDE ET APPAREIL POUR LE SCIAGE DE PIERRES GEMMES

摘要

The process is used to cut precious stones e.g. diamonds in two utilising a band saw of which the band (10') has a width of three or more times its thickness. The band may be of the endless and unjointed type, and may be driven at a speed of not less than 25m per sec. Several stones may be cut simultaneously by utilising one or both edges of the band and all stones being treated are brought into individual contact with a band edge (37, 37'). A typical machine may use a band (10') traversing a driven (30) and an idling (31) roller the active roller faces being plane or curved. Diamond powder may be applied to one or both cutting edges, and workpiece diamonds may be mounted in individual displacable holders (38, 38').