首页> 外国专利> A PROCESS FOR COPPER PLATING OF METALS AND THEIR ALLOYS SUCH AS STAINLESS STEEL TANTALUM AND TITANIUM

A PROCESS FOR COPPER PLATING OF METALS AND THEIR ALLOYS SUCH AS STAINLESS STEEL TANTALUM AND TITANIUM

机译:不锈钢及其钛合金中的铜及其合金的镀铜工艺

摘要

A process for the copper plating of metals and their alloys such as stainless steel, tantalum and titanium comprising the cleaning, roughening and etching of the job prior to electroplating thereof, characteried by activating the surface of the job by immersion in an activating bath containing copper sulphate, fluoride ions and a known wetting agent such as herein described: and electroplating the job in a known manner, thereafter, in a bath containing copper sulphate, fluoride ions and sulphuric acid.
机译:一种对金属及其合金(例如不锈钢,钽和钛)进行铜镀的方法,包括在电镀之前对工件进行清洁,粗糙化和蚀刻,其特征在于,通过浸入包含铜的活化浴中来活化工件的表面硫酸盐,氟化物离子和已知的润湿剂(如此处所述);然后在包含硫酸铜,氟化物离子和硫酸的浴中以已知方式电镀工件。

著录项

  • 公开/公告号IN149262B

    专利类型

  • 公开/公告日1981-10-17

    原文格式PDF

  • 申请/专利权人 RAMACHANDRA SIVARMAKRISHNAN;

    申请/专利号IN28MA1979

  • 发明设计人 RAMACHANDRA SIVARMAKRISHNAN;

    申请日1979-02-13

  • 分类号C23B5/18;

  • 国家 IN

  • 入库时间 2022-08-22 16:11:50

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