Compsns. comprises (A) 100 pts. wt. of silicone-modified epoxy resin formed by the reaction of (a) 5-70 pts. wt. of alkylphenylpolysiloxane of formula RaSiXbO(4-a-b)/2 (I) and (b) 95-30 pts. wt. of epoxy resin contg. =2 epoxy gps. in one molecule, (B) 0.01-30 pts. wt. of alkoxy gp.-contg. organopolysiloxane of formula R1cSi(OR2)dO(4-c-d)/2 (II) and (C) hardener for (A). In the formula R is alkyl, phenyl with ratio alkyl/phenyl being 0.3-3.0; X is alkoxy and/or OH; a is 0.9-1.8; b is 0.01-2; R1 is (un)substd. monovalent hydrocarbon gp.; R2 is alkylf c is 0.9-1.8; d is 0.01-2. Component (a) has Si-bonded OH gp. and/or alkoxy in an amt. of 0.01-2 per one Si atom. Component (b) includes e.g. Epikote 828, Epikote 1001 (RTM). Component (C) includes, e.g. ethylenediamine, monoethanolamine, aniline, dichloromaleic acid. Opt. additives such as (in)organic pigment, silica, glass fibre, clay, mica., Al powder may be added to the resin compsn. The compsn. has excellent moisture resistance and boiling water resistance.
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