SOLUTION FOR THE ELECTROCHEMICAL METALLIZATION OF DIELECTRIC MATERIALS, METHOD FOR ELECTROCHEMICAL METALLIZATION OF DIELECTRIC MATERIALS USING THE SAME SOLUTION, AND DIELECTRIC MATERIALS TREATED IN ACCORDANCE WITH THE METHOD

摘要

The invention relates to electrochemistry. The solution forming the subject of the invention is of the type containing a copper salt, a salt containing a phosphorus, a stabilizing agent and water, and IS CHARACTERIZED IN THAT AS A SALT CONTAINING PHOSPHORUS IT CONTAINS A SALT OF HYPOPHOSPHOROUS ACID. THE COMPOSITION OF THE SOLUTION IS THE FOLLOWING (GL): / P P SALT OF COPPER, 35 TO 350; / P P SALT OF HYPOPHOSPHOROUS ACID, 35 TO 400; / P P STABILIZATION AGENT, 0.004 TO 250; / P P WATER, UP TO 1L. / P P THE SOLUTION IN QUESTION MAY BE USED IN PARTICULAR TO PRODUCE A CONDUCTIVE CURRENT LAYER ON THE SURFACE OF A DIELECTRIC BEFORE THE ELECTROCHEMICAL APPLICATION OF A METAL COATING, ALSO FUNCTIONAL OR DECORATIVE, ON THE SURFACE OF A LAMINATE BASED ON GLASS FABRIC.