ADHESIVE COMPOSITION AND METHOD FOR ADHESION BETWEEN METAL AND METAL

摘要

A thermally conductive, hot melt adhesive composition for use in metal-to-metal bonding is characterised in that it comprises: (i) at least one amorphous, thermoplastic, polyamide resin, the resin having a softening point of no greater than about 150`C, and the resin(s) comprising from 30-90% by weight of the adhesive composition; and (ii) a metal powder filler, the metal being selected from the group consisting of aluminium and copper, and the powder comprising from 10-70% by weight of the composition. A method of bonding metal substrates using this adhesive composition is also disclosed.