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PREPARATION OF SILICON NITRIDE FILMS BY PHOTOCHEMICAL VAPOR DEPOSITION
PREPARATION OF SILICON NITRIDE FILMS BY PHOTOCHEMICAL VAPOR DEPOSITION
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机译:光化学气相沉积法制备氮化硅膜
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摘要
Low temperature photonitride (LTPN) films of excellent quality have been prepared at temperatures ranging from 300° C. downward to 100. degree. C. by a photochemical vapor deposition process, wherein a mixture of silane, ammonia, and hydrazine is caused to react to form Si. sub.3 N. sub.4 films at the substrate interface. These films are suitable for the preparation of silicon nitride passivation layers on solid-state devices, such as metal-oxide semiconductors (MOS) and charge coupled devices to impart enhanced reliability.
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机译:已经在从300℃向下至100℃的温度范围内制备了高质量的低温光氮化物(LTPN)膜。 C.通过光化学气相沉积法,其中使硅烷,氨和肼的混合物反应以形成Si。基板界面处的sub.3 N. sub.4膜。这些膜适用于在固态器件(例如金属氧化物半导体(MOS)和电荷耦合器件)上制备氮化硅钝化层,以增强可靠性。
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