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To adjust a semi - conductive with respect to an irradiation mask during the photolithography, to the x-rays

机译:在光刻过程中将相对于辐照掩模的半导体调整为X射线

摘要

In an illustrative embodiment marks with dual x-ray permeable apertures are at three spaced locations on the mask and transmit x-ray beams which are directed obliquely to the semiconductor surface. In this case, the marks on the semiconductor disc may be formed by monocrystals shaped in conformity with the incident beam cross section and located so as to produce reflected x-ray beams which intersect correspondingly shaped further apertures of the respective dual aperture marks on the mask. Alternatively the beams may impinge on the surface of the semiconductor disc itself at an angle to produce reflection, with x-ray absorbing material surrounding each reflecting region. In either case the reflected beams as transmitted by the further apertures are detected as a measure of the degree of parallelism of the mask and semiconductor disc.
机译:在说明性实施例中,具有双X射线可穿透孔的标记位于掩模上的三个间隔位置处,并透射倾斜地指向半导体表面的X射线束。在这种情况下,半导体盘上的标记可以由单晶形成,该单晶的形状与入射光束的横截面一致,并且被定位以便产生反射的X射线束,该X射线束与掩模上各个双孔标记的相应的其他孔的形状相交。可选择地,光束可以以一定角度撞击在半导体盘自身的表面上以产生反射,同时X射线吸收材料围绕每个反射区域。在任一种情况下,由其他孔透射的反射光束都被检测为掩模和半导体盘的平行度的量度。

著录项

  • 公开/公告号FR2392421B1

    专利类型

  • 公开/公告日1982-04-23

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号FR19780015244

  • 发明设计人

    申请日1978-05-23

  • 分类号G03F9/00;

  • 国家 FR

  • 入库时间 2022-08-22 12:31:39

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