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Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
Mechanical shock and impact resistant ceramic semiconductor package and method of making the same
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机译:耐机械冲击和冲击的陶瓷半导体封装及其制造方法
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摘要
A mechanical shock and impact resistant ceramic semiconductor package is formed by applying a resilient, non-conductive, non-absorbent, heat- resistant material onto the surfaces of said package. In a dual in- line ceramic package a silicone polymer is discretely applied onto at least one end of the longitudinally opposite end edge surfaces. This renders the package mechanical shock and impact resistant.
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