首页> 外国专利> PROCESS FOR REINFORCING AN INTEGRAL ADDITIVE THERMOPLASTIC ORGANIC POLYMER TO IMPROVE THE PHYSICAL PROPERTIES OF A THERMOPLASTIC ORGANIC POLYMER CONTAINING COMPOSITE LOAD THERMOPLASTIC ORGANIC POLYMER

PROCESS FOR REINFORCING AN INTEGRAL ADDITIVE THERMOPLASTIC ORGANIC POLYMER TO IMPROVE THE PHYSICAL PROPERTIES OF A THERMOPLASTIC ORGANIC POLYMER CONTAINING COMPOSITE LOAD THERMOPLASTIC ORGANIC POLYMER

机译:增强整体添加剂热塑有机聚合物的物理性能,以改善复合负载热塑有机聚合物的热塑有机聚合物的物理性能

摘要

Novel methods are described for providing filled thermoplastic polymers by the integral addition, to the polymer/filler mixture, of a surfactant with or without a polymerizable unsaturated silicon compound containing at least one =SiO-group and not more than five silicon atoms, e.g., a polymerizable unsaturated hydrolyzable silane, and/or a polymerizable unsaturated organic compound having two or more polymerizable unsaturated groups and novel filler/polymer compositions containing a surfactant are described. In addition novel integral additives containing surfactant and a polymerizable unsaturated silicon compound containing at least one =SiO-group and not more than five silicon atoms, e.g., a polymerizable unsaturated hydrolyzable silane, and/or a polymerizable unsaturated organic compound having two or more polymerizable unsaturated groups are described.
机译:描述了通过将表面活性剂整体添加到聚合物/填料混合物中而提供填充的热塑性聚合物的方法,所述表面活性剂具有或不具有包含至少一个= SiO-基团且不超过五个硅原子的可聚合不饱和硅化合物,例如,描述了可聚合的不饱和可水解硅烷和/或具有两个或更多个可聚合的不饱和基团的可聚合的不饱和有机化合物,以及包含表面活性剂的新型填料/聚合物组合物。另外,包含表面活性剂和包含至少一个= SiO-基且不超过五个硅原子的可聚合不饱和硅化合物的新型整体添加剂,例如可聚合不饱和可水解硅烷,和/或具有两个或多个可聚合的可聚合不饱和有机化合物。描述了不饱和基团。

著录项

  • 公开/公告号BR8205011A

    专利类型

  • 公开/公告日1983-08-09

    原文格式PDF

  • 申请/专利权人 UNIO CARBIDE CORP;

    申请/专利号BR19828205011

  • 发明设计人 GODLEWSKI ROBERT EVERETT;

    申请日1982-08-26

  • 分类号C08J3/20;C08F291/00;

  • 国家 BR

  • 入库时间 2022-08-22 11:16:58

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