Hot melt adhesive compositions comprising hydrogenated resin and ethylene- polar vinylic compound copolymer or wax

摘要

A hot melt adhesive composition comprising (I) a hydrogenated resin having a softening point of 60°-130° C. obtained by the hydrogenation of a copolymer resin prepared by reacting (A) at least one five-membered cyclic compound such as cyclopentadiene with (B) at least one dimer or trimer of the five-membered cyclic compound, isoprene and piperylene in specified ratios by weight, and (II) an ethylene type copolymer and/or wax.