PATTERN DETECTING METHOD OF FULL AUTOMATIC WIRE BONDING

摘要

PURPOSE:To detect circuit patterns of a semiconductor device surely and correctly by a method wherein a pair of panetrating holes are provided in a circuit substrate, and positional informations of the penetrating holes are utilized. CONSTITUTION:The IC substrate 12 has a pair of the penetrating holes 13, 14, and pads 15, 16, the circuit patterns 17, 18, a circuit element 19 are put on the upper face thereof. The discrepancy of the substrate 12 is corrected by arithmetic treatment detecting the positions of the portraits of penetrating holes 13, 14. At this time, although mirror finishing is performed on the surface of IC, precision of detection is enhanced because level difference of light and darkness of the portraits of penetrating holes is large. After then, necessary sections are corrected respectively according to arithmetic informations for correction, and wire bonding 20 are performed in order. By this method, bonding can be performed automatically having favorable yield.