glidklammer for such beklednadsmaterial, der an insulating layer positioned between the substrate and beklednadsmaterialet you

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  机译： 具有穿过基板，导电垫和绝缘层的开口位置的电子基板

• 4. Semiconductor device fabricating method, involves simultaneously forming electronic devices in or on exposed massive semiconductor region of substrate and superficial semiconductor layer that is positioned on continuous insulating layer [P] . 法国专利： FR2933232A1 . 2010-01-01

  机译： 半导体器件的制造方法，涉及在衬底和位于连续绝缘层上的表面半导体层的暴露的块状半导体区域中或上同时形成电子器件。

• 5. procedure for positioning of a thin conductive metal layers on an insulating substrate [P] . DK341478A . 1980-02-02

  机译： 在绝缘基板上放置导电金属薄层的步骤

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