首页>
外国专利>
Polyester amides and application thereof to the bonding of organic and inorganic substrates
Polyester amides and application thereof to the bonding of organic and inorganic substrates
展开▼
机译:聚酯酰胺及其在有机和无机基材粘合中的应用
展开▼
页面导航
摘要
著录项
相似文献
摘要
What are disclosed are a polyesteramide prepared by the condensation of (A) a dimerized fatty acid having 16-44 carbon atoms, (B) a diamine of the formula H2N-R-NH2 wherein R is aliphatic hydrocarbon having 2-36 carbon atoms, (C) diglycolamine (H2N-CH2CH2-CH2-CH2-OH), and, optionally, (D) at least one dicarboxylic acid of the formula R''COOC-R'-COOR'', wherein R' is an aliphatic, cycloaliphatic, aromatic, or araliphatic hydrocarbon having 4 to 12 carbon atoms and R'' is hydrogen or alkyl having 1 to 8 carbon atoms, and the use of such a polyesteramide as a melt adhesive for organic and inorganic substrates.
展开▼