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Cross-coupled transistor memory cell for MOS random access memory of reduced power dissipation

机译:用于降低功耗的MOS随机存取存储器的交叉耦合晶体管存储单元

摘要

A memory cell of the general type employing one pair of IGFETs defining data nodes and cross-coupled in a latch circuit configuration for storing data, and another pair of IGFETs serving as transmission gates to selectively couple data into or out of the cell. A circuit technique provides fast writing speed by avoiding the use of load resistors in either the charge or discharge paths for the data nodes and yet ensures that the data nodes are pulled either fully to logic high or fully to logic low, as the case may be, without limitation by threshola voltage offset between the gate and source terminals of the IGFETs serving as transmission gates. High impedance leakage current discharge resistances are included, and serve only the function of discharging leakage at the nodes to maintain memory. In the disclosed circuit configurations, the latch IGFETs are of opposite channel conductivity type compared to the gating lG-FETs. Various alternative forms of suitable high impedance leakage current resistances are disclosed, including a resistive sea above the cell and leakage paths included within the gating IGFETs. The high impedance leakage current discharge resistances may be eliminated to provide a dynamic memory cell.
机译:普通类型的存储单元采用一对IGFET定义数据节点并在锁存电路配置中交叉耦合以存储数据,而另一对IGFET用作传输门以选择性地将数据耦合到单元中或从单元中耦合出去。电路技术通过避免在数据节点的充电或放电路径中使用负载电阻来提供快速的写入速度,并确保根据情况将数据节点完全拉至逻辑高或完全拉至逻辑低。不受限于用作传输门的IGFET的栅极和源极端子之间的阈值电压偏移的限制。包括高阻抗泄漏电流放电电阻,并且仅起到在节点处放电泄漏以维持存储的功能。在所公开的电路配置中,与门控IG-FET相比,锁存IGFET具有相反的沟道导电类型。公开了合适的高阻抗泄漏电流电阻的各种替代形式,包括电池上方的电阻海和选通IGFET中包括的泄漏路径。可以消除高阻抗泄漏电流放电电阻,以提供动态存储单元。

著录项

  • 公开/公告号EP0113867A2

    专利类型

  • 公开/公告日1984-07-25

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC COMPANY;

    申请/专利号EP19830112445

  • 发明设计人 ENGELER WILLIAM ERNEST;MAZIN MOSHE;

    申请日1983-12-10

  • 分类号G11C11/40;

  • 国家 EP

  • 入库时间 2022-08-22 08:57:43

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