Stripline microwave circuit for direct satellite broadcast receiver - comprises thin substrate carrying SHF and UHF circuits on same face, with ground plane on lower face

摘要

The thin substrate carries microstrip SHF and UHF circuits on the same face. A ground plane is carried on its lower face against which is a thicker substrate with a ground plane on its lower face. Rivets ensure mechanical and electrical connection of circuit layers. The SHF circuits comprise sections of high impedance line in thin strips which permits provision of inductive reactances of high value. Metallisation with large dimensions provide decoupling capacities while wide metallic strips provide high impedances for resonant circuits. Small dimension areas (34) allow transistors to be connected. The UHF circuits have similar metallic strips for high and low impedances. Metallic strips on the lower face of the thick substrate permit power distribution to the circuits.