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Method of raising the breakdown voltage of an integrated capacitor and capacitor manufactured by this method

机译:提高集成电容器的击穿电压的方法以及通过该方法制造的电容器

摘要

The invention relates to a method suitable for raising the breakdown voltage of a capacitor of the integrated circuit type formed on a semiconductor substrate and characterized in that the lower plate of the capacitor is under etched so that an air wedge is obtained. As a result of the air wedge, the electric current passed through the semiconductor material is lengthened and the breakdown phenomena at the edges of the capacitor are reduced. The invention also relates to capacitors obtained in this manner.
机译:本发明涉及一种适于提高形成在半导体衬底上的集成电路型电容器的击穿电压的方法,其特征在于,对电容器的下板进行蚀刻,从而获得气楔。由于空气楔,流过半导体材料的电流变长,并且减少了电容器边缘处的击穿现象。本发明还涉及以此方式获得的电容器。

著录项

  • 公开/公告号US4475120A

    专利类型

  • 公开/公告日1984-10-02

    原文格式PDF

  • 申请/专利权人 U.S. PHILIPS CORPORATION;

    申请/专利号US19820391266

  • 发明设计人 MICHEL J. M. BINET;

    申请日1982-06-24

  • 分类号H01L29/00;H01L21/441;H01L21/465;

  • 国家 US

  • 入库时间 2022-08-22 08:37:22

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