首页> 外国专利> Process for metalizacao substrates of ceramics; method to apply a printed circuit on the substrate of ceramics, process for production of a pattern conductor metallic article of ceramics.Method for joining two articles of ceramica

Process for metalizacao substrates of ceramics; method to apply a printed circuit on the substrate of ceramics, process for production of a pattern conductor metallic article of ceramics.Method for joining two articles of ceramica

机译:陶瓷金属基体处理工艺;在陶瓷基板上施加印刷电路的方法,生产陶瓷的图案导体金属制品的方法。将两个陶瓷制品接合的方法

摘要

An article comprised of metal directly and adherently bonded onto a ceramic substrate, and a process for producing same, are described, wherein the ceramic is adhesion promoted with molten inorganic compounds, treated with halide compounds that promote adsorption of species rendering said surfaces receptive for metal deposition, and plated with metal. Uniform surface coverage with said species and metal is ensured by the halide treatment.
机译:本发明描述了一种由金属直接和粘合地结合到陶瓷基底上的制品及其制造方法,其中用熔融的无机化合物促进陶瓷的粘合,用卤化物处理以促进物质吸附从而使所述表面能接受金属的卤化物处理。沉积,并镀上金属。通过卤化物处理确保了所述物质和金属的均匀表面覆盖。

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