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method for the passivation of the surface of a pn junction intercept
method for the passivation of the surface of a pn junction intercept
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机译:pn结截距表面钝化的方法
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p id="P-ENG-00001" num="00001"br / The invention relates to a semiconductor device including a semiconductor body having a surface, at least two areas of the types of conductivity opposed in the body, a junction PN with the interface between the two areas, this junction PN extending to surface from the body, and a layer of polycrystalline silicon of strong resistivity on surface. /p[FR2382094A1]
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机译:id =“ P-ENG-00001” num =“ 00001”> 本发明涉及一种半导体器件,包括:具有表面的半导体本体,在本体中相对的至少两个导电类型的区域,具有两个区域之间的界面的结PN,该结PN从本体延伸到表面。在表面形成一层电阻率高的多晶硅。 p> [FR2382094A1]
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