A process for electroplating a sheet of copper highly engineering level, ductile, bright, substantially uniform hardness and not retractable, on a conductive substrate

摘要

An aqueous acidic solution contains copper in an amount sufficient to electrodeposit copper on a substrate and a controlled combination of bath soluble and compatible organic brightening agents including: (1) one or more organic polyether compounds; (2) one or more organic sulphide compounds; and (3) at least one compound selected from each of: (A) A 5-phenylphenazinium derivative having the formula: IMAGE (B) a substituted phthalocyanine, and (C) an alkylated polyethyleneimine reaction product having a quaternary nitrogen. The bath enables the deposition of a non-annealing engineering copper plate suitable for mechanical engraving. The plate may be on a rotogravure cylinder.