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Interconnection carrier on a printed circuit for an integrated-circuit housing, and interconnection system utilizing such a carrier

机译:用于集成电路壳体的印刷电路上的互连载体,以及使用这种载体的互连系统

摘要

1. An interconnection support for an integrated circuit housing (36) on a printed circuit (38), wherein the support (1) is constituted by a flexible dielectric material (7) formed from a crown having a central opening (20) and provided on one of its faces with a first series of electrical contacts (2), each contact extending substantially up to the edge of the central opening, characterized in that said crown is provided on the other of its faces with a second series of electrical contacts (33), each of them being connected to one of the contacts (2) of the first series, and disposed substantially at the periphery of the crown, so as to leave a free space (d5 ) between each contact (33) of the second series and the edge of the central opening (20).
机译:1.一种用于印刷电路(38)上的集成电路壳体(36)的互连支撑件,其中,所述支撑件(1)由柔性电介质材料(7)构成,所述柔性电介质材料由具有中央开口(20)的冠部形成并设置在其一个侧面上具有第一系列电触头(2),每个触头基本上向上延伸到中央开口的边缘,其特征在于,所述顶部在其另一侧面上具有第二系列电触头( 33),它们中的每一个都连接到第一组触点中的一个(2),并且基本上设置在表冠的外围,以便在第二个触点中的每个触点(33)之间留出自由空间(d5)系列和中央开口(20)的边缘。

著录项

  • 公开/公告号EP0083265B1

    专利类型

  • 公开/公告日1985-09-11

    原文格式PDF

  • 申请/专利权人 SOCAPEX;

    申请/专利号EP19820402290

  • 发明设计人 BRICAUD HERVE;OLIVE JEAN-LOUIS;

    申请日1982-12-14

  • 分类号H01L23/48;H01L23/52;

  • 国家 EP

  • 入库时间 2022-08-22 08:03:06

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