Method for supplementing, in circuitry terms, a thick-film circuit board which is wired up using thick-film technology, and a tuning device produced with the aid of this method

摘要

The invention relates to a method for supplementing, in circuitry terms, a thick-film circuit board (1), which is wired up using thick-film technology and is provided with further electrical functional complexes. The functional complexes are connected to the circuit of the circuit board (1) by soldering, after being fitted. In addition to the thick-film circuit on its upper side, the board is also provided on its lower side with printed wiring runs (72), and the wiring runs (69, 72) on both sides are connected to one another in part via through-plated holes (83). In order to complete the board (1), chip components (71) are bonded onto the lower side (7) without soldering paste and a tin paste is applied onto the upper side (9), into which the components (71) which are to be soldered on are inserted in an adhering manner. For soldering, the lower side (7) is passed through liquid solder and soldered, the thick-film board (1) being heated to such an extent by the solder in the bath that the soldering paste on the upper side (9) melts. If, at the same time, compartmentalisation frames (3, 5) are soldered onto both sides of the circuit board (1) in the same soldering process, then, after assembly and after the single soldering process, a functional tuning device is produced. IMAGE