首页> 外国专利> Components soldering method to PCB - is a low temp. process using current pulses and can be easily automated

Components soldering method to PCB - is a low temp. process using current pulses and can be easily automated

机译:将元件焊接到PCB的方法-是低温的。使用电流脉冲进行处理,可轻松实现自动化

摘要

The method of soldering electronic components, rotatably integrated circuits, avoids the need for elevated temps. and can be incorporated into a rapid automated process. It is applicable to components having flat terminal blades which lie on top of printed board tracks or pads. A tool (7) having a cavity (8) of approximately the same form as the component has an internal tube connected to a suction system in order to hold the component. Side arms of the tool press the component leads (3) onto the printed circuit pads (5). A current-pulse generator (13) has probe connectors planted on the tracks leading to the terminals to be soldered. When the correct mechanical pressure between the tool head and component lead is achieved, a current pulse of intensity and duration sufficient to solder the joint between leads and pads is applied by the generator. The tool lead can be either grounded with respect to the generator probes or, alternatively, the probes can be grounded and the tool lead can be the source of current pulses.
机译:焊接可旋转集成电路的电子元件的方法避免了高温的需要。并可以纳入快速的自动化流程中。它适用于具有扁平端子刀片的组件,这些端子刀片位于印刷电路板轨道或焊盘的顶部。具有与部件大致相同的形式的腔(8)的工具(7)具有连接至抽吸系统的内管,以保持部件。工具的侧臂将组件引线(3)压在印刷电路板(5)上。电流脉冲发生器(13)在通向待焊接端子的轨道上植入了探头连接器。当在工具头和零件引线之间达到正确的机械压力时,发生器将施加强度和持续时间足以焊接引线和焊盘之间的接头的电流脉冲。工具引线可以相对于发电机探头接地,或者探针可以接地,工具引线可以是电流脉冲源。

著录项

  • 公开/公告号FR2523396B3

    专利类型

  • 公开/公告日1985-01-11

    原文格式PDF

  • 申请/专利权人 RADANT ETUDE;

    申请/专利号FR19820004168

  • 发明设计人

    申请日1982-03-12

  • 分类号H05K3/34;H01L21/603;

  • 国家 FR

  • 入库时间 2022-08-22 07:56:08

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