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Process for producing a tin/lead alloy solder joint with less wetting agent residue
Process for producing a tin/lead alloy solder joint with less wetting agent residue
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机译:具有较少润湿剂残留的生产锡/铅合金焊点的方法
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摘要
Surfaces of copper or brass which are to be joined by tin/lead alloy soldering in a non-oxydizing atmosphere are first wetted by a treating liquid containing an organic solvent typified by ethyl alcohol; a polyhydric alcohol derivative typified by ethylene glycol; and an organic, halogen-containing activator typified by aniline hydrochloride. In the resulting soldered joint, the solder has spread acceptably well and little oxidation or wetting agent resident is formed.
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