METHOD OF PLATING THROUGH HOLE USED FOR CONNECTION BETWEEN BOTH SURFACES OF THICK FILM SUBSTRATE WHILE SILK SCREEN PRINTING OPERATION IS PERFORMED

摘要

To perform a large quantity of the interfacial metallization or parietal holes or cavities of a substrate 19 in the art of the layers thick by serigraphie and which consists in sending a high flow of air under a slight depression in the chamber door - substrate 8, simultaneously with the operation of serigraphie. The apparatus used for this purpose is a gas turbine a speed variator 10. The measurements of the physical parameters of the air stream (speed and or flow) are carried by means of a measuring equipment comprising a sensor 14 and the indicator 15 adapted to control the coating of the pate in the thickness of the substrate, which allows the metallization selective of said holes or cavities. / p & & p & application: devices for serigraphie.