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FORMED MATERIAL OF HYDROGEN OCCULUSION ALLOY

机译:氢吸收合金的锻造材料

摘要

PURPOSE:To provide the titled formed material having high heat-conductivity, preventing the pulverization of the alloy, by using powder of hydrogen-occulusion alloy in combination with a specific amount of a synthetic resin having a softening temperature higher than the temperature to release hydrogen from the alloy. CONSTITUTION:The objective formed material contains (A) 85-97wt% of powder of a hydrogen-occulsion alloy [preferably the alloy of formula LaNi5-H, MmNi5-xAlx-H (x is 0.1-0.7) or MmNi5-xMnx] having a fineness of preferably finer than 10 mesh and (B) 15-3wt% of a synthetic resin (e.g. polyurethane, phenolic resin, etc.) havng a softening point higher than the temperature to release the hydrogen occluded in said alloy (preferably a softening point of =100 deg.C).
机译:用途:通过使用氢咬合合金粉末与一定量的软化温度高于释放氢的温度的合成树脂组合,提供具有高导热性,防止合金粉碎的标题成型材料从合金。组成:目标成型材料包含(A)85-97wt%的氢吸氢合金粉末[最好是式LaNi5-H,MmNi5-xAlx-H(x为0.1-0.7)或MmNi5-xMnx的合金],细度最好小于10目,并且(B)合成树脂(例如聚氨酯,酚醛树脂等)的15-3wt%的软化点要高于释放在所述合金中吸留的氢的温度(最好是软化) > = 100摄氏度)。

著录项

  • 公开/公告号JPS6116776B2

    专利类型

  • 公开/公告日1986-05-02

    原文格式PDF

  • 申请/专利权人 SANTOKU KINZOKU KOGYO KK;

    申请/专利号JP19830021640

  • 发明设计人 TOMA HIDEO;

    申请日1983-02-14

  • 分类号C08K3/00;C01B3/00;C08K3/02;C08K3/08;C08K3/10;C08L101/00;

  • 国家 JP

  • 入库时间 2022-08-22 07:49:38

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