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SURFACE IONIZATION TYPE CESIUM ION SOURCE

机译:表面电离型铯离子源

摘要

PURPOSE:To enable selection between large current ion flow and thin ion flow by arranging a restrictor enable of operation of the hole diameter from the outside of vacuum immediately in the rear of a chip for causing surface ionization in surface ionization type cesium ion source. CONSTITUTION:Cesium ionizing material 1 is vaporized by means of a filament 6 to cause surface ionization on a porous tungsten chip 2 then the quantity of ion is controlled through a control electrode 3 to take out the cesium ions through a take-out electrode 4. Here, a plate restrictor 5 having plural holes of about 100-1,000mum diameter is arranged immediately in the rear of the chip 2 operatably from the outside of vacuum. The large current ion flow and the thin ion flow are made selectable through selection of hole diameter while to enable shielding of the post stage electrodes 3, 4. Consequently, selection of ion take-out is facilitated while contamination of the electrode due to ionized material can be prevented.
机译:用途:为了通过在芯片背面立即从真空外部操作孔径的限制器来实现在大电流离子流和稀离子流之间进行选择,从而在表面电离型铯离子源中引起表面电离。组成:铯离子化材料1通过细丝6蒸发,在多孔钨片2上引起表面离子化,然后通过控制电极3控制离子量,以通过取出电极4吸收铯离子。在此,在芯片2的后侧,可操作地从真空外部将具有多个直径为大约100-1,000μm的孔的板限制器5布置在芯片2的后面。通过选择孔径,可以选择大电流离子流和薄离子流,同时可以屏蔽后级电极3、4。因此,有利于选择离子取出,同时由于电离材料而污染电极可以预防。

著录项

  • 公开/公告号JPS61203535A

    专利类型

  • 公开/公告日1986-09-09

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP19850042677

  • 发明设计人 IZUMI EIICHI;TOIDA HIROSHI;

    申请日1985-03-06

  • 分类号H01J37/08;H01J27/26;

  • 国家 JP

  • 入库时间 2022-08-22 07:46:05

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