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The electrodialysis apparatus for chemical maintenance of non-electrolytic kobberpletteringsbade

机译:用于非电解科布特勃金德巴斯化学维护的电渗析设备

摘要

Apparatus for preventing depletion of an electroless copper plating bath (66) comprises an electrolytic cell (26) divided by permselective membranes (38,40) into a catholyte compartment (28), an anolyte compartment (32) and between them an electroless copper solution compartment (36). A catholyte such as aqueous sodium hydroxide is circulated to and from the catholyte compartment from a source (62) by a pump (54). An anolyte such as aqueous sulphuric acid is circulated to and from the anolyte compartment (32) from a source (60) by a pump (58) and the electroless copper solution is circulated from the plating bath (66) to the copper solution compartment (36) of the cell and back, by a pump (68).
机译:用于防止化学镀铜槽(66)耗尽的设备包括电解池(26),电解池(26)被选择性渗透膜(38,40)分成阴极电解液室(28),阳极电解液室(32),以及在它们之间的化学镀铜溶液隔间(36)。诸如氢氧化钠水溶液之类的阴极电解液通过泵(54)从源(62)循环进出阴极电解液室。诸如硫酸水溶液之类的阳极电解液通过泵(58)从离子源(60)往返于阳极电解液室(32)循环,无电镀铜溶液从电镀浴(66)循环至铜溶液室( 36)的电池并通过泵(68)返回。

著录项

  • 公开/公告号DK14086A

    专利类型

  • 公开/公告日1986-07-15

    原文格式PDF

  • 申请/专利权人 MORTON THIOKOL INC.;

    申请/专利号DK19860000140

  • 发明设计人 KORNGOLD EMANUEL;

    申请日1986-01-13

  • 分类号C23C;

  • 国家 DK

  • 入库时间 2022-08-22 07:42:25

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