HIGH-PURITY PALLADIUM-NICKEL ALLOY PLATING BATH, PROCESS THEREFOR AND ALLOY-COVERED ARTICLES AND GOLD- OR GOLD ALLOY-COVERED ARTICLES OF ALLOY-COVERED ARTICLES

摘要

A high-purity palladium-nickel alloy plating bath containing 1 to 15% nickel, particularly suited for plating electronic parts, process therefor, and articles covered by the alloy and the alloy-covered articles further covered by gold or gold alloy.