首页> 外国专利> Method of manufacture of several components on a single body semi - conductor and objects of the music box forms, for its implementation

Method of manufacture of several components on a single body semi - conductor and objects of the music box forms, for its implementation

机译:用于实现单块半导体上的几个组件的方法以及音乐盒形式的对象,用于其实现

摘要

Integrated circuit elements e.g. transistors, in a semi-conductor body are electrically insulated from one another by etching a groove 8 into the semi-conductor body between said elements and back-filling the groove with an insulative resin so as to present a substantially smooth supporting surface on said semi-conductor body for application of conductive material forming electrical connections 15 between said elements. Preferably the resin provides a uniform layer 11 over the surface of the semi-conductor body and, before the resin is applied, an oxide layer 2 is formed over the walls of the groove. IMAGE
机译:集成电路元件通过在所述元件之间的半导体本体中刻蚀凹槽8并用绝缘树脂回填该凹槽,从而在所述半导体上提供基本上光滑的支撑表面,从而使半导体本体中的晶体管彼此电绝缘。 -用于施加导电材料的导体主体,在所述元件之间形成电连接15。优选地,树脂在半导体本体的表面上方提供均匀的层11,并且在施加树脂之前,在凹槽的壁上方形成氧化物层2。 <图像>

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